ADF7241 datasheet(71/72 Pages) AD

71 / 72 page

ADF7241

Rev. 0 | Page 71 of 72

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

3.45

3.30 SQ

3.15

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

Figure 69. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF7241BCPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-13

ADF7241BCPZ-RL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-13

EVAL-ADF7241DB1Z

Evaluation Platform Daughterboard

EVAL-ADF7XXXMB3Z

Evaluation Platform Motherboard

1 Z = RoHS Compliant Part.

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