ADP5033ACBZ-1-R7 datasheet(6/28 Pages) AD

6 / 28 page

ADP5033

Rev. 0 | Page 6 of 28

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

VIN1, VIN2, VIN3, VIN4, VOUT1, VOUT2,

VOUT3, VOUT4, ENA, MODE, ENB to

Ground

–0.3 V to +6 V

Storage Temperature Range

–65°C to +150°C

Operating Junction Temperature Range

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

ESD Human Body Model

±1500 V

ESD Charged Device Model

±500 V

ESD Machine Model

±100 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

For detailed information on power dissipation, see the Power

Dissipation and Thermal Considerations section.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

ΨJB

Unit

16-Ball, 0.5 mm Pitch WLCSP

°C/W

ESD CAUTION

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