2 ______________________________________________________________________________________

Low-Power Headset Detectors

with SEND/END Button Support

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(Voltages referenced to ground.)

Continuous Current into Any Terminal .......................... Q100mA

TDFN (derate 11.9mW/NC above +70NC) .................953.5mW

Operating Temperature Range.......................... -40NC to +85NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ...............................+300NC

Soldering Temperature (reflow) ......................................+260NC

TDFN

ELECTRICAL CHARACTERISTICS

(Note 2)

ABSOLUTE MAXIMUM RATINGS

PACKAGE THERMAL CHARACTERISTICS (Note 1)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Supply Voltage Range

2.5

5.5

V

Threshold

0.9

1.7

2.45

V

MODE = low, DETIN = high

0.8

1.3

F

A

MODE = low, DETIN = low,

8

11

MODE = high, DETIN = low,

500

800

DETIN Pullup Resistance

1000

kI

Internal Microphone Bias Voltage

MODE = low

V

MODE = high, DETIN = low

2.2

MIC SEND/END Detection

Threshold

0.20 O

0.22 O

0.24 O

V

DETIN Detection Threshold

Falling edge

1/3 O

1/2 O

2/3 O

V