2002 Nov 22

17

Philips Semiconductors

Product specification

PCF8574

12 PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT38-4

92-11-17

95-01-14

c

(e )

1

A

L

e

D

Z

16

1

9

8

E

pin 1 index

b

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.30

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

0.76

4.2

0.51

3.2

inches

0.068

0.051

0.021

0.015

0.014

0.009

1.25

0.85

0.049

0.033

0.77

0.73

0.26

0.24

0.14

0.12

0.01

0.10

0.30

0.32

0.31

0.39

0.33

0.030

0.17

0.020

0.13

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4