OUT

A2

A1

B2

B1

IN-

IN+

GND

INA216

SBOS503B – JUNE 2010 – REVISED JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

PRODUCT

GAIN

PACKAGE-LEAD

DESIGNATOR

PACKAGE MARKING

INA216A1

25V/V

WCSP-4

YFF

OW

INA216A2

50V/V

WCSP-4

YFF

OX

INA216A3

100V/V

WCSP-4

YFF

OY

INA216A4

200V/V

WCSP-4

YFF

OZ

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

INA216

UNIT

Supply Voltage

+7

V

–5.5 to +5.5

V

Analog Inputs,

(2)

GND–0.3V to +5.5

V

GND–0.3V to (V+)+0.3

V

5

mA

Operating Temperature

–55 to +150

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

+150

°C

Human Body Model

2.5

kV

ESD Ratings:

Charged Device Model

1

kV

Machine Model

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

(3)

Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5mA.

PIN CONFIGURATION

YFF PACKAGE

WCSP-4

(TOP VIEW)

(1)

Bump side down. Drawing not to scale.

(2)

Power supply is derived from shunt (minimum common-mode range = 1.8V)

2

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Product Folder Link(s): INA216