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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC334LP4

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H334

XXXX

HMC334LP4E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H334

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

Typical Supply

Current vs. Supply Voltage

+4.5

146

+5.0

173

+5.5

200

Downconverter will operate over full voltage range shown above.

Absolute Maximum Ratings

+21 dBm

+12 dBm

VccLO, VccIF

+6 Vdc

Channel Temperature

150 °C

Continuous Pdiss (T = 85°C)

(derate 27.8 mW/°C above 85°C)

1.8 W

Thermal Resistance

(channel to ground paddle)

36 °C/W

Storage Temperature

-65 to 150 °C

Operating Temperature

-40 to 85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

v03.0410

SiGe WIDEBAND

DOWNCONVERTER, 0.6 - 2.7 GHz