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TJ2997GD 데이터시트(PDF) 7 Page - HTC Korea TAEJIN Technology Co.

부품명 TJ2997GD
상세설명  DDR Termination Regulator
PDF  13 Pages
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제조업체  HTC [HTC Korea TAEJIN Technology Co.]
홈페이지  http://www.htckorea.co.kr
Logo HTC - HTC Korea TAEJIN Technology Co.

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DDR Termination Regulator
TJ2997
Apr, 2011 - R1.0.1
7/13
HTC
THERMAL DISSIPATION
Since the TJ2997 is a linear regulator any current flow from VTT will result in internal power dissipation
generating heat.
To prevent damaging the part from exceeding the maximum allowable junction
temperature, care should be taken to derate the part dependent on the maximum expected ambient
temperature and power dissipation. The maximum allowable internal temperature rise, TRmax can be
calculated given the maximum ambient temperature, TAmax of the application and the maximum allowable
junction temperature, TJmax.
T
Rmax = TJmax − TAmax
From this equation, the maximum allowable power dissipation, P
Dmax of
the part can be
calculated:
P
Dmax
= T
Rmax
/ θ
JA
The maximum allowable value for junction-to-ambient thermal resistance, θJA, can be calculated using
the formula:
θJA = TRmax / PD = (TJmax – TAmax) / PD
The θJA of the TJ2997 will be dependent on several variables: the package used; the thickness of
copper; the number of vias and the airflow. For instance, the θJA of the SOP8 is 165°C/W with the
package mounted to a standard 8x4 2-layer board with 1oz. copper, no airflow, and 0.5W dissipation at
room temperature. This value can be reduced to 152°C/W by changing to a 3x4 board with 2 oz. copper
that is the JEDEC standard.
Additional improvements can be made by the judicious use of vias to connect the part and
dissipate heat to an internal ground plane.
Using larger traces and more copper on the top side of
the board can also help.
With careful layout it is possible to reduce the θ
JA further than the nominal
values. Additional improvements in lowering the θJA can also be achieved with a constant airflow
across the package.
Optimizing the θ
JA and placing the TJ2997 in a section of a board exposed to lower ambient
temperature allows the part to operate with higher power dissipation. The internal power dissipation
can be calculated by summing the three main sources of loss: output current at V
TT, either sinking or
sourcing, and quiescent current at AVIN and VDDQ. During the active state (when enable is not held low)
the total internal power dissipation can be calculated from the following equations:
P
D
= P
AVIN
+ P
VDDQ
+ P
VTT
Where, PAVIN = IAVIN x VAVIN
P
VDDQ
= V
VDDQ
x I
VDDQ
= V
VDDQ2
x R
VDDQ
To calculate the maximum power dissipation at V
TT both conditions at VTT need to be examined,



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