전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

494LP3E 데이터시트(PDF) 3 Page - Hittite Microwave Corporation

부품명 494LP3E
상세설명  SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  HITTITE [Hittite Microwave Corporation]
홈페이지  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

494LP3E 데이터시트(HTML) 3 Page - Hittite Microwave Corporation

  494LP3E Datasheet HTML 1Page - Hittite Microwave Corporation 494LP3E Datasheet HTML 2Page - Hittite Microwave Corporation 494LP3E Datasheet HTML 3Page - Hittite Microwave Corporation 494LP3E Datasheet HTML 4Page - Hittite Microwave Corporation 494LP3E Datasheet HTML 5Page - Hittite Microwave Corporation 494LP3E Datasheet HTML 6Page - Hittite Microwave Corporation  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
6
6 - 132
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Note: Divider will operate over full voltage range shown above
RF Input (Vcc = +5V)
+13 dBm
Supply Voltage (Vcc1, Vcc2)
+5.5V
Channel Temperature (Tc)
135 °C
Continuous Pdiss (T = 85 °C)
(derate 11.9 mW/° C above 85 °C)
593 mW
Thermal Resistance (R
TH
)
(junction to ground paddle)
84 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
ESD Sensitivity (HBM)
Class 1A
Vcc1, Vcc2 (V)
Icc (mA)
4.75
90
5.0
103
5.25
115
-500
-300
-100
100
300
500
22.7
23.1
23.5
23.9
24.3
24.7
TIME (nS)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC494LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
494
XXXX
HMC494LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
494
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
HMC494LP3 / 494LP3E
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
v04.0507



Html Pages

1 2 3 4 5 6


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com