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20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

8

8 - 161

v02.0706

SiGe HBT MMIC LOW NOISE

AMPLIFIER, 1.2 - 3.0 GHz

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC548LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

548

XXXX

HMC548LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

548

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

Pin Number

Function

Description

Interface Schematic

1RFIN1

This pin is DC coupled and matched to

50 Ohms from 1.2 to 2.0 GHz.

An off chip blocking capacitor is required.

2, 3, 5 - 8,10,

11, 13, 14, 16

GND

These pins and package ground paddle

must be connected to RF/DC ground.

4RFOUT1

This pin is AC coupled and matched to

50 Ohms from 1.2 - 2 GHz.

9RFIN2

This pin is DC coupled and matched to

50 Ohms from 1.2 to 2.0 GHz.

An off chip blocking capacitor is required.

12

RFOUT2

This pin is AC coupled and matched to

50 Ohms from 1.2 - 2 GHz.

15

Vcc

Power supply voltage for the amplifier. External bypass

capacitors of 1,000pF and 18,000 pF are required.

Pin Descriptions