For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

7

7 - 6

Outline Drawing

HMC667LP2 / 667LP2E

v02.1110

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 2.3 - 2.7 GHz

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC667LP2

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

667

XXX

HMC667LP2E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

667

XXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 3-Digit lot number XXX

Package Information

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.