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Document Number: 72505

S11-0303-Rev. D, 28-Feb-11

Vishay Siliconix

DG3001, DG3002, DG3003

PACKAGE OUTLINE

MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 µm BUMP HEIGHT)

Notes (Unless Otherwise Specified):

a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.

Notes:

a. Use millimeters as the primary measurement.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

Index-Bump A1

Note c

Top Side (Die Back)

XXX

3003

Recommended Land Pattern

0.5

0.5

6 x Ø 0.150

Note b

Solder Mask Ø

Silicon

Bump

Note a

b Diameter

32

1

A

B

e

D

e

A

S

S

E

EUTECTIC (Sn/Pb)

Dim.

Inches

Min.

Max.

Min.

Max.

A

0.610

0.685

0.0240

0.0270

0.140

0.190

0.0055

0.0075

0.470

0.495

0.0185

0.0195

b

0.180

0.250

0.0071

0.0098

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0101

LEAD (Pb)-FREE (Sn/Ag/Cu)

Dim.

Inches

Min.

Max.

Min.

Max.

A

0.688

0.753

0.0271

0.0296

0.218

0.258

0.0086

0.0102

0.470

0.495

0.0185

0.0195

b

0.306

0.346

0.0120

0.0136

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0102