Document Number: 67493

www.vishay.com

Revison: 07-Feb-11

1

Package Information

Vishay Siliconix

CASE OUTLINE FOR TDFN8 2 x 2

Note

1. All dimensions are in millimeters which will govern.

2. Max. package warpage is 0.05 mm.

3. Max. allowable burrs is 0.076 mm in all directions.

4. Pin #1 ID on top will be laser/ink marked.

5. Dimension applies to meatlized terminal and is measured

between 0.20 mm and 0.25 mm from terminal tip.

6. Applied only for terminals.

7. Applied for exposed pad and terminals.

Top View

Side View

Bottom View

K

K

L

D2

Pin 1 Indicator

(Optional)

8

7

6

5

1

2

3

4

1

2

3

4

8

7

6

5

D

A

A3

A1

7

6

0.05 C

Index Area

(D/2 x E/2)

MILLIMETERS

INCHES

DIM.

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

0.50

0.55

0.60

0.020

0.022

0.024

A1

0.00

-

0.05

0.000

-

0.002

A3

0.152 REF

0.006 REF

b

0.18

0.23

0.28

0.007

0.009

0.011

D

1.95

2.00

2.05

0.077

0.079

0.081

D2

0.75

0.80

0.85

0.030

0.031

0.033

e

0.50 BSC

0.020 BSC

E

1.95

2.00

2.05

0.077

0.079

0.081

E2

1.40

1.45

1.50

0.055

0.057

0.059

K

-

0.20

-

-

0.008

-

L

0.30

0.35

0.40

0.012

0.014

0.016

ECN: C11-0033 Rev. A, 07-Feb-11

DWG: 5997