SIP32452 datasheet(9/10 Pages) VISHAY

9 / 10 page

SiP32452, SiP32453

Vishay Siliconix

Document Number: 63315

S11-1695-Rev. B, 22-Aug-11

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE OUTLINE

MICRO FOOT®: 4 Bumps (2 x 2, 0.4 mm Pitch, 208 µm Bump Height)

Notes:

1. Laser mark on the backside surface of die.

2. Bumps are SAC396.

3. 0.050 max. coplanarity.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

reliability data, see www.vishay.com/ppg?63315

Dimension

MILLIMETERS

INCHES

Min.

Nom.

MAX.

Min.

Nom.

MAX.

0.515

0.530

0.545

0.0202

0.0208

0.0214

0.208

0.0081

0.250

0.260

0.270

0.0098

0.0102

0.0106

0.400

0.0157

0.720

0.760

0.800

0.0182

0.0193

0.0203

4 x Ø b

Bump Note 2

Index-Bump A1

Mark on backside of die

Recommended Land Pattern

All dimensions in millimeters

0.4

4 x Ø 0.150 to 0.200

Solder mask dia.

- Pad diameter + 0.1

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