Document Number: 81129

www.vishay.com

Rev. 1.3, 29-Mar-10

3

T8514VB

Specification of GaAlAs IR Emitting

Diode Chip

Vishay Semiconductors

Note

The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip

backside is performed with stereo microscope with incident light and 40x to 80x magnification.

The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure

by QM is not installed.

HANDLING AND STORAGE CONDITIONS

• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It

is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.

• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined

in MIL-HDBK-263.

• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.

PACKING

Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers

are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and

contamination).

Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take

back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for

packing material that is returned unsorted or which we are not obliged to accept.

MECHANICAL DIMENSIONS

PARAMETER

SYMBOL

MIN.

TYP.

MAX.

UNIT

Length of chip edge (x-direction)

0.37

mm

Length of chip edge (y-direction)

0.37

mm

Emission area

0.325 x 0.325

Die height

H

0.17

mm

Diameter of bondpad

d

0.14

mm

Frontside metallization, anode

Aluminum

Backside metallization, cathode

Gold alloy

Dicing

Sawing

Die bonding technology

Epoxy bonding