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W25Q16CLZPIP 데이터시트(PDF) 69 Page - Winbond

부품명 W25Q16CLZPIP
상세설명  2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
PDF  77 Pages
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제조업체  WINBOND [Winbond]
홈페이지  http://www.winbond.com
Logo WINBOND - Winbond

W25Q16CLZPIP 데이터시트(HTML) 69 Page - Winbond

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W25Q16CL
Publication Release Date: July 08, 2010
- 69 -
Preliminary - Revision A
13. PACKAGE SPECIFICATION
13.1 8-Pin SOIC 150-mil (Package Code SN)
L
θ
c
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
4
1
5
8
L
θ
c
D
A1
A
e
b
b
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E H
E
E H
E
4
1
5
8
MILLIMETERS
INCHES
SYMBOL
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
b
0.33
0.51
0.013
0.020
c
0.19
0.25
0.008
0.010
E
(3)
3.80
4.00
0.150
0.157
D
(3)
4.80
5.00
0.188
0.196
e
(2)
1.27 BSC
0.050 BSC
HE
5.80
6.20
0.228
0.244
Y
(4)
---
0.10
---
0.004
L
0.40
1.27
0.016
0.050
θ
0°
10°
0°
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.



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