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W25Q32BVZPAP 데이터시트(PDF) 9 Page - Winbond |
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W25Q32BVZPAP 데이터시트(HTML) 9 Page - Winbond |
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9 / 79 page ![]() W25Q32BV Publication Release Date: April 01, 2011 - 9 - Revision F 3.7 Ball Configuration TFBGA 8x6-mm Top View A1 NC NC NC A2 A3 A4 NC B1 VCC GND CLK B2 B3 B4 NC D1 /HOLD(IO 3) DI(IO 0) DO(IO 1) /WP (IO 2) D2 D3 D4 NC E1 NC NC NC E2 E3 E4 NC F1 NC NC NC F2 F3 F4 NC C1 NC /CS C2 C3 C4 NC Figure 1e. W25Q32BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TC) 3.8 Ball Description TFBGA 8x6-mm BALL NO. PIN NAME I/O FUNCTION B2 CLK I Serial Clock Input B3 GND Ground B4 VCC Power Supply C2 /CS I Chip Select Input C4 /WP (IO2) I/O Write Protect Input (Data Input Output 2)* 2 D2 DO (IO1) I/O Data Output (Data Input Output 1)* 1 D3 DI (IO0) I/O Data Input (Data Input Output 0)* 1 D4 /HOLD (IO3) I/O Hold Input (Data Input Output 3)* 2 Multiple NC No Connect *1 IO0 and IO1 are used for Standard and Dual SPI instructions *2 IO0 – IO3 are used for Quad SPI instructions |
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