EPC101 datasheet(6/7 Pages) EPC

6 / 7 page

epc101

Reflow Solder Profile

For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for

Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.

Packaging Information (all measures in mm)

Tape & Reel Information

The devices are mounted on embossed tape for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch)

reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the

tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA) standard

481-1, 481-2, 481-3.

Pin 1

CSP6 Tape

QFN16 Tape

Pin 1

CSP6 Tape

QFN16 Tape

epc does not guarantee that there are no empty cavities.

Thus, the pick-and-place machine should do check the presence of a chip during picking.

Order Information

Part Number

Package

RoHS compliance

Packaging Method

epc100-CSP10

CSP10

Yes

Reel

epc100-QFN16

QFN16

Yes

Reel

epc101-CSP10

CSP10

Yes

Reel

epc101-QFN16

QFN16

Yes

Reel

Characteristics subject to change without notice

Datasheet epc101 - V2.1

EPC101 데이터시트(PDF) 6 Page - Espros Photonics corp