LD6806 datasheet(28/36 Pages) PHILIPS

28 / 36 page

LD6806_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 9 December 2011

28 of 36

NXP Semiconductors

LD6806 series

Ultra low-dropout regulator, low noise, 200 mA

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

15.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

15.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 44) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 16 and 17

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Table 16.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

C)

Volume (mm3)

< 350

 350

< 2.5

235

220

 2.5

220

Table 17.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

LD6806 데이터시트(PDF) 28 Page - NXP Semiconductors

LD6806 데이터시트(HTML) 28 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

데이터시트 다운로드

링크 URL