LD6806F datasheet(29/36 Pages) PHILIPS

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LD6806_SER

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Product data sheet

Rev. 3 — 9 December 2011

29 of 36

NXP Semiconductors

LD6806 series

Ultra low-dropout regulator, low noise, 200 mA

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 44.

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

16. Mounting

16.1 PCB design guidelines

It is recommended, for optimum performance, to use a Non-Solder Mask Defined

(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias

connecting the ground pads to a buried ground-plane layer. This results in the lowest

possible ground inductance and provides the best high frequency and ESD performance.

Refer to Table 18 for the recommended PCB design parameters.

MSL: Moisture Sensitivity Level

Fig 44. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 18.

Recommended PCB design parameters

Parameter

Value or specification

PCB pad diameter

250

m

Micro-via diameter

100

m (0.004 inch)

Solder mask aperture diameter

325

m

Copper thickness

m to 40 m

Copper finish

AuNi or OSP

PCB material

FR4

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