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C2084 데이터시트(PDF) 2 Page - M/A-COM Technology Solutions, Inc.

부품명 C2084
상세설명  Ceramic Surface Mount Amplifier
PDF  3 Pages
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제조업체  MA-COM [M/A-COM Technology Solutions, Inc.]
홈페이지  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

C2084 데이터시트(HTML) 2 Page - M/A-COM Technology Solutions, Inc.

  C2084 Datasheet HTML 1Page - M/A-COM Technology Solutions, Inc. C2084 Datasheet HTML 2Page - M/A-COM Technology Solutions, Inc. C2084 Datasheet HTML 3Page - M/A-COM Technology Solutions, Inc.  
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Ceramic Surface Mount Amplifier
Rev. V3
Application Note
C2084
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
2
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
4. Thermal Design Considerations
The power dissipated in the amplifiers is deter-
mined by the bias voltage and current. With a bias
voltage of +12V and a typical current of 88 mA, the
total power dissipation in an amplifier is 1.06 W. It
is critical that the end user’s PC board is designed
so that 1.06 W can be removed from the vicinity of
the amplifier. We recommend using 1 oz copper
on the layer of the board where the ceramic SMT
amplifiers are mounted.
Note that the amplifiers
should be soldered, not epoxied to the PC board.
5. PCB Design Guidelines
The outline drawing for the amplifier is provided in
Figure 3. The actual pad sizes on the LGA bottom
are defined here. When the amplifier is mounted to
the PC board, use the “Recommended PC Board
Mounting Pattern”, which is provided in Figure 4. A
dotted line indicates the physical size of the bottom
of the package. It should be noted that the entire
length of the RF traces on the ceramic should be
soldered to the PC board. The RF traces on the
PC board should then extend beyond the edge of
the package as shown in Figure 4. This keeps the
solder area larger, which increases the strength.
This also allows for inspection of the solder joints.
The recommended solder for mounting surface
mount packages is Sn63 (63% Sn, 37% Pb) be-
cause it is a eutectic compound with a melting point
(183ºC) high enough to exceed the standard oper-
ating limit of the devices, but low enough to avoid
damaging internal circuitry during proper solder
reflow operations.
Figure 2. AM05-0005 Top and Bottom
Views
Figure 3. AM05-0005 Outline Drawing



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