TCS3404, TCS3414

DIGITAL COLOR SENSORS

TAOS137A − APRIL 2011

39

The LUMENOLOGY

r Company

r

r

Copyright

E 2011, TAOS Inc.

www.taosinc.com

MANUFACTURING INFORMATION

Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and

vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the

package molding compound contains the smallest amount of absorbed moisture possible, each device is

dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica

gel to protect them from ambient moisture during shipping, handling, and storage before use.

CS Package

The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under

the following conditions:

Temperature Range

5

°C to 50°C

Relative Humidity

60% maximum

Floor Life

1 year out of bag at ambient < 30

°C / 60% RH

Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,

it should be done at 50

°C for 12 hours.

FN Package

The FN package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under

the following conditions:

Temperature Range

5

°C to 50°C

Relative Humidity

60% maximum

Total Time

12 months from the date code on the aluminized envelope — if unopened

Opened Time

168 hours or fewer

Rebaking will be required if the devices have been stored unopened for more than 12 months or if the aluminized

envelope has been open for more than 168 hours. If rebaking is required, it should be done at 50

°C for 12 hours.