Data Sheet

ADP2164

Rev. 0 | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, VIN, SW

−0.3 V to +7 V

FB, SYNC, TRK, RT, EN, PGOOD

−0.3 V to +7 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

board. The exposed pad is soldered to the printed circuit board

with thermal vias.

Table 3. Thermal Resistance

Package Type

θ

JA

Unit

16-Lead LFCSP

38.3

°C/W

ESD CAUTION