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LTC3226

3226fa

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating

junction temperature range, otherwise specifications are at TA = 25°C (Note 3). VIN = 3.3V, VCPO = 5V, VOUT = 3.3V, VMID = 1/2 VCPO

unless otherwise noted.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

LDO

Minimum CPO Voltage for LDO Operation

2.4

VLDO_FB

LDO FB Servo Voltage

IVOUT = 1mA

0.76

0.8

0.82

Load Regulation ΔVLDO_FB/ΔIOUT

1mA < IVOUT < 2A

2.7

mV/A

LDO FET RDS(ON)

VCPO = 3.6V

200

mΩ

ILDO_FB(LEAK) LDO_FB Input Leakage Current

VLDO_FB = 0.9V

–60

ILIM

LDO Current Limit

RST_FB, RST

VRST_FB(TH)

RST_FB Threshold (Falling Edge)

0.72

0.74

0.76

VRST_FB(HYS) RST_FB Hysteresis

IRST_FB(LEAK) RST_FB Input Leakage Current

VRST_FB = 0.9V

–50

RST Output Low Voltage

ISINK = 5mA

RST High Impedance Leakage Current

VRST = 5V

1μA

RST Delay (RST_FB Rising)

290

Power-Fail Comparator

VPFI(TH)

PFI Input Threshold (Falling Edge)

1.175

1.2

1.225

VPFI(HYS)

PFI input Hysteresis

IPFI(LEAK)

PFI Input Leakage Current

VPFI = 0.5V

–50

PFO Output Low Voltage

ISINK = 5mA

IPFO(LEAK)

PFO High Impedance Leakage Current

VPFO = 5V

1μA

PFI Delay to PFO (PFI Falling)

0.5

μs

EN_CHG

VIH

Input High Voltage

1.3

VIL

Input Low Voltage

0.4

IIH

Input High Current

–1

μA

IIL

Input Low Current

–1

μA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal resistance much greater than

58.7°C/W.

Note 3: The LTC3226 is tested under pulsed load conditions such that TA ≈ TJ.

The LTC3226E is guaranteed to meet specifications from 0°C to 85°C

junction temperature. Specifications over the –40°C to 125°C operating

junction temperature range are assured by design, characterization and

correlation with statistical process controls. The LTC3226I is guaranteed

over the full –40°C to 125°C operating junction temperature range. The

junction temperature, TJ, is calculated from the ambient temperature, TA,

and power dissipation, PD, according to the formula:

TJ = TA + (PD • 58.7°C/W)

Note that the maximum ambient temperature consistent with these

specifications is determined by specific operating conditions in

conjunction with board layout, the rated thermal package thermal

resistance and the environmental factor.

Note 4: Output not in regulation; ROL = (2 • VIN – VCPO)/ICPO.

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