| 전자부품 데이터시트 검색엔진 |
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LTC1992 데이터시트(PDF) 22 Page - Linear Technology |
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LTC1992 데이터시트(HTML) 22 Page - Linear Technology |
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22 / 24 page ![]() LTC2369-18 22 236918fa 3.00 ±0.10 (2 SIDES) 4.00 ±0.10 (2 SIDES) NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 0.75 ±0.05 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 1.70 ± 0.05 3.15 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 2.20 ±0.05 0.70 ±0.05 3.60 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 3.30 ±0.05 0.45 BSC 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.70 ± 0.10 R = 0.115 TYP R = 0.05 TYP 3.15 REF 1 8 16 9 (DE16) DFN 0806 REV Ø PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER 3.30 ±0.10 0.23 ± 0.05 0.45 BSC 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE DE Package 16-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1732 Rev Ø) MS Package 16-Lead Plastic MSOP (Reference LTC DWG # 05-08-1669 Rev Ø) MSOP (MS16) 1107 REV Ø 0.53 ± 0.152 (.021 ± .006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 16151413121110 1234567 8 9 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 0.254 (.010) 0 ° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.305 ± 0.038 (.0120 ± .0015) TYP 0.50 (.0197) BSC 4.039 ± 0.102 (.159 ± .004) (NOTE 3) 0.1016 ± 0.0508 (.004 ± .002) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 0.280 ± 0.076 (.011 ± .003) REF 4.90 ± 0.152 (.193 ± .006) 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. |
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