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EDJ8232B5MB 데이터시트(PDF) 49 Page - Elpida Memory |
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EDJ8232B5MB 데이터시트(HTML) 49 Page - Elpida Memory |
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49 / 142 page ![]() EDJ8232B5MB Data Sheet E1825E30 (Ver. 3.0) 49 [DDR3-1333 Speed Bins] Speed Bin DDR3-1333H CL-tRCD-tRP 9-9-9 Symbol /CAS write latency min. max. Unit Notes tAA 13.125 20 ns 8 tRCD 13.125 ns 8 tRP 13.125 ns 8 tRC 49.125 ns 8 tRAS 36 9 tREFI ns 7 tCK (avg) @CL=5 CWL = 5 3.0 3.3 ns 1, 2, 3, 4, 5 CWL = 6, 7 Reserved Reserved ns 4 tCK (avg) @CL=6 CWL = 5 2.5 3.3 ns 1, 2, 3, 5 CWL = 6 Reserved Reserved ns 4 CWL = 7 Reserved Reserved ns 4 tCK (avg) @CL=7 CWL = 5 Reserved Reserved ns 4 CWL = 6 1.875 < 2.5 ns 1, 2, 3, 4, 5 CWL = 7 Reserved Reserved ns 4 tCK (avg) @CL=8 CWL = 5 Reserved Reserved ns 4 CWL = 6 1.875 < 2.5 ns 1, 2, 3, 5 CWL = 7 Reserved Reserved ns 4 tCK (avg) @CL=9 CWL = 5, 6 Reserved Reserved ns 4 CWL= 7 1.5 < 1.875 ns 1, 2, 3, 4 tCK (avg) @CL=10 CWL = 5, 6 Reserved Reserved ns 4 CWL= 7 1.5 < 1.875 ns 1, 2, 3 Supported CL settings 5, 6, 7, 8, 9, 10 nCK Supported CWL settings 5, 6, 7 nCK Notes: 1. The CL setting and CWL setting result in tCK (avg) (min.) and tCK (avg) (max.) requirements. When making a selection of tCK (avg), both need to be fulfilled: Requirements from CL setting as well as requirements from CWL setting. 2. tCK (avg) (min.) limits: Since /CAS latency is not purely analog - data and strobe output are synchronized by the DLL - all possible intermediate frequencies may not be guaranteed. An application should use the next smaller JEDEC standard tCK (avg) value (2.5, 1.875, 1.5, or 1.25ns) when calculating CL (nCK) = tAA (ns) / tCK (avg)(ns), rounding up to the next ‘Supported CL’. 3. tCK (avg) (max.) limits: Calculate tCK (avg) + tAA (max.)/CL selected and round the resulting tCK (avg) down to the next valid speed bin (i.e. 3.3ns or 2.5ns or 1.875ns or 1.25ns). This result is tCK (avg) (max.) corresponding to CL selected. 4. ‘Reserved’ settings are not allowed. User must program a different value. 5. Any DDR3-1333 speed bin also supports functional operation at lower frequencies as shown in the table DDR3-1333 Speed Bins which is not subject to production tests but verified by design/characterization. 6. Any DDR3-1600 speed bin also supports functional operation at lower frequencies as shown in the table DDR3-1600 Speed Bins which is not subject to production tests but verified by design/characterization. 7. tREFI depends on operating case temperature (TC). 8. For devices supporting optional down binning to CL = 7 and CL = 9, tAA/tRCD/tRP(min.) must be 13.125 ns or lower. SPD settings must be programmed to match. |
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