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MK30DX64VMB7 데이터시트(PDF) 2 Page - Freescale Semiconductor, Inc

부품명 MK30DX64VMB7
상세설명  K30 Sub-Family
PDF  72 Pages
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제조업체  FREESCALE [Freescale Semiconductor, Inc]
홈페이지  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MK30DX64VMB7 데이터시트(HTML) 2 Page - Freescale Semiconductor, Inc

  MK30DX64VMB7 Datasheet HTML 1Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 2Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 3Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 4Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 5Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 6Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 7Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 8Page - Freescale Semiconductor, Inc MK30DX64VMB7 Datasheet HTML 9Page - Freescale Semiconductor, Inc Next Button
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Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................10
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.2.1
Voltage and current operating requirements.........10
5.2.2
LVD and POR operating requirements.................12
5.2.3
Voltage and current operating behaviors..............12
5.2.4
Power mode transition operating behaviors..........13
5.2.5
Power consumption operating behaviors..............14
5.2.6
Designing with radiated emissions in mind...........18
5.2.7
Capacitance attributes..........................................18
5.3 Switching specifications.....................................................19
5.3.1
Device clock specifications...................................19
5.3.2
General switching specifications...........................19
5.4 Thermal specifications.......................................................20
5.4.1
Thermal operating requirements...........................20
5.4.2
Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1
Debug trace timing specifications.........................22
6.1.2
JTAG electricals....................................................23
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
MCG specifications...............................................25
6.3.2
Oscillator electrical specifications.........................28
6.3.3
32kHz Oscillator Electrical Characteristics............30
6.4 Memories and memory interfaces.....................................31
6.4.1
Flash electrical specifications................................31
6.4.2
EzPort Switching Specifications............................35
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
6.6.1
ADC electrical specifications.................................37
6.6.2
CMP and 6-bit DAC electrical specifications.........45
6.6.3
12-bit DAC electrical characteristics.....................47
6.6.4
Voltage reference electrical specifications............50
6.7 Timers................................................................................51
6.8 Communication interfaces.................................................52
6.8.1
CAN switching specifications................................52
6.8.2
DSPI switching specifications (limited voltage
range)....................................................................52
6.8.3
DSPI switching specifications (full voltage range).53
6.8.4
I2C switching specifications..................................55
6.8.5
UART switching specifications..............................55
6.8.6
I2S/SAI Switching Specifications..........................55
6.9 Human-machine interfaces (HMI)......................................60
6.9.1
TSI electrical specifications...................................60
6.9.2
LCD electrical characteristics................................61
7 Dimensions...............................................................................62
7.1 Obtaining package dimensions.........................................62
8 Pinout........................................................................................63
8.1 K30 Signal Multiplexing and Pin Assignments..................63
8.2 K30 Pinouts.......................................................................68
9 Revision History........................................................................70
K30 Sub-Family Data Sheet, Rev. 2, 4/2012.
2
Freescale Semiconductor, Inc.



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