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AFE030 데이터시트(PDF) 49 Page - Texas Instruments |
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AFE030 데이터시트(HTML) 49 Page - Texas Instruments |
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49 / 58 page ![]() 1 2 3 4 5 6 7 8 Number of Layers 36 34 32 30 28 26 24 22 20 THERMAL RESISTANCE vs NUMBER OF PCB LAYERS PCB Area = 3 in , 2 oz Cu (Results are from thermal simulations) 2 28 26 24 22 20 18 16 14 12 10 2 4 6 8 10 12 14 PCB Area (in ) 2 THERMAL RESISTANCE vs BOARD AREA Four-Layer PCB, 2 oz Cu (Results are from thermal simulations) 35 33 31 29 27 25 23 21 19 17 15 0.5 1 1.5 2 2.5 Cu Thickness (oz) Four-Layer PCB, PCB Area = 4.32 in , 2 oz Cu (Results are from thermal simulations) 2 AFE030 www.ti.com SBOS588A – DECEMBER 2011 – REVISED DECEMBER 2011 Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors that improve the spread of heat. Figure 55 through Figure 57, respectively, show thermal resistance performance as a function of each of these factors. Figure 55. Thermal Resistance as a Function of the Number of Layers in the PCB Figure 56. Thermal Resistance as a Function of PCB Area Figure 57. Thermal Resistance as a Function of Copper Thickness Copyright © 2011, Texas Instruments Incorporated 49 Product Folder Link(s): AFE030 |
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