LTC4290/LTC4271

30

429071f

4.00 0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION

(WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT

PIN 1

TOP MARK

(NOTE 6)

0.40 0.10

24

23

1

2

BOTTOM VIEW—EXPOSED PAD

2.45 0.10

(4-SIDES)

0.75 0.05

R = 0.115

TYP

0.25 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF24) QFN 0105

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 0.05

0.25 0.05

0.50 BSC

2.45 0.05

(4 SIDES)

3.10 0.05

4.50 0.05

PACKAGE OUTLINE

PIN 1 NOTCH

R = 0.20 TYP OR

0.35 x 45º CHAMFER

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

UF Package

24-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1697)

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.