LT3798

19

3798f

PACKAGE DESCRIPTION

MSOP (MSE16) 0911 REV E

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

16

16151413121110

1234567 8

9

9

1

8

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL

NOT EXCEED 0.254mm (.010") PER SIDE.

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305

± 0.038

(.0120

± .0015)

TYP

0.50

(.0197)

BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845

± 0.102

(.112

± .004)

2.845

± 0.102

(.112

± .004)

4.039

± 0.102

(.159

± .004)

(NOTE 3)

1.651

± 0.102

(.065

± .004)

1.651

± 0.102

(.065

± .004)

0.1016

± 0.0508

(.004

± .002)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

0.280

± 0.076

(.011

± .003)

REF

4.90

± 0.152

(.193

± .006)

DETAIL “B”

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.12 REF

0.35

REF

MSE Package

16-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1667 Rev E)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.