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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LPS110012XXXBO15E 데이터시트(PDF) 3 Page - Vishay Siliconix |
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LPS110012XXXBO15E 데이터시트(HTML) 3 Page - Vishay Siliconix |
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3 / 5 page  LPS 1100 www.vishay.com Vishay Sfernice Revision: 05-Sep-12 3 Document Number: 50059 For technical questions, contact: sfer@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Note • Configuration 1: Water cooling heatsink (CP15 from Lytron (304 mm x 95.3 mm x 8 mm) with water flow rate 4LPM and thermal grease Si340 from BlueStar Silicones Configuration 2: Air cooling heatsink P207/250 from Semikron (250 mm x 200 mm x 72 mm) and thermal grease Si340 from BlueStar Silicones Configuration 3: Water cooling heatsink (CP15 from Lytron (304 mm x 95.3 mm x 8 mm) with water flow rate 4LPM and thermal pad Q-pad II from Berquist Configuration 4: Air cooling heatsink P207/250 from Semikron (250 mm x 200 mm x 72 mm) and thermal pad Q-pad II from Berquist OVERLOAD In any case the applied voltage must be lower than UI = 6600 V. Short time overload: 2 x Pr/10 s for heatsink with Rth(h-a) 0.26 °C/W (maximum power: 700 W) and 1.6 x Pr/1 s for heatsink with 0.26 °C/W > Rth(h-a) 0.059 °C/W (maximum power: 1800 W). Accidental overload: The values indicated on the following graph are applicable to resistors in air or mounted onto a heatsink. ENERGY CURVE MARKING Series, style, ohmic value (in ), tolerance (in %), manufacturing date, Vishay Sfernice trademark. POWER RATING The temperature of the case should be maintained within the limit specified in the following figure. To optimize the thermal conduction, contacting surfaces should be coated with silicone grease or thermal film, and heatsink mounting screws tightened to 2 Nm. CONFIG. 1: WATER COOLING HEATSINK CP15 AND THERMAL GREASE SI340 CONFIG. 2: AIR COOLING HEATSINK P207/250 AND THERMAL GREASE SI340 CONFIG. 3: WATER COOLING HEATSINK CP15 AND THERMAL PAD Q-PAD II CONFIG. 4: AIR COOLING HEATSINK P207/250 AND THERMAL PAD Q-PAD II Power Dissipation (W) 1100 350 650 285 T° Resistive Element (°C) 200 200 200 200 Rth(j-c) max. (°C/W) 0.039 0.039 0.039 0.039 Rth(c-h) typ. (°C/W) 0.070 0.201 0.187 0.315 Rth(h-a) max. (°C/W) 0.059 0.260 0.059 0.260 Fluid T° (°C) 15 (water) 25 (air) 15 (water) 25 (air) 0.01 0.1 1 10 100 10 000 OVERLOAD DURATION IN s 1 10-7 10-6 10-5 10-4 10-3 10-2 10-1 1000 PACKAGING Box of 15 units 0 20 40 60 80 100 HEATSINK TEMPERATURE IN °C 200 0175 150 125 100 75 50 25 ORDERING INFORMATION LPS 1100 1 k ± 1 % xxx BO15 e MODEL STYLE RESISTANCE VALUE TOLERANCE CUSTOM DESIGN PACKAGING LEAD (Pb)-FREE ± 1 % ± 2 % ± 5 % ± 10 % Optional on request: special TCR, shape, etc. |
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