SiC SCHOTTKY DIODE

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Semelab ltd

Semelab ltd

Semelab ltd

Semelab ltd

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Document Number 9166

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Issue 2

Page 1 of 6

SML05SC06D3A / SML05SC06D3B

A = 25°C unless otherwise stated)

VRRM

Peak Repetitive Reverse Voltage

600V

VRSM

Surge Peak Reverse Voltage

600V

IF(AVG)

Average Forward Current

(1)

5A

IFSM

Non-Repetitive Peak Forward Surge Current

(3,4)

60A

PD

Total Power Dissipation at

TA = 25°C

2.96

(2)

Derate Above TA = 25°C

14.8mW/°C

(2)

TJ

Junction Temperature Range

-55 to +225°C

Tstg

Storage Temperature Range

-55 to +225°C

THERMAL PROPERTIES

Symbols

Parameters

Max.

Units

RθJSP(IN)

Thermal Resistance, Junction To Solder Pads TSP = 25°C

29

°C/W

Thermal Resistance, Junction To Ambient, On PCB

67.5

°C/W

Thermal Resistance, Junction To Ambient, On PCB

123

°C/W

Notes

Notes

Notes

Notes

(1)

IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where

TJ(Max) does not exceed 175°C; This equates to RθJA(PCB) ≤ 68°C/W.

(2)

PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.

(3)

PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.

IO1 is rated at 1.0A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.

(4)

MIL-STD-750 Method 4066.4 Condition A1. I

A = 25°C.

‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.