SL3ICS1002 datasheet(54/56 Pages) NXP

54 / 56 page

139036

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Product data sheet

COMPANY PUBLIC

Rev. 3.6 — 10 March 2011

139036

54 of 56

NXP Semiconductors

SL3ICS1002/1202

UCODE G2XM and G2XL

22. Tables

Table 1.

Ordering information G2XM . . . . . . . . . . . . . . . .3

Table 2.

Ordering information G2XL. . . . . . . . . . . . . . . . .3

Table 3.

Pin description of SOT1040-1 . . . . . . . . . . . . . .6

Table 4.

Pin description of TSSOP8. . . . . . . . . . . . . . . . .7

Table 5.

TSSOP8 Marking . . . . . . . . . . . . . . . . . . . . . . . .8

Table 6.

Pin description of SOT1122 . . . . . . . . . . . . . . .10

Table 7.

SOT1122 Marking. . . . . . . . . . . . . . . . . . . . . . .10

Table 8.

Mechanical properties SOT1040AA1 . . . . . . . .16

Table 9.

Mechanical properties SOT1040AB2 . . . . . . . .16

Table 10. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . .17

Table 11. Wafer characteristics . . . . . . . . . . . . . . . . . . . .18

Table 12. Package interface characteristics . . . . . . . . . . .18

Table 13. Symbol description . . . . . . . . . . . . . . . . . . . . . .22

Table 14. Operating distances for UCODE G2X based

tags and labels in released frequency bands . .22

Table 15. G2X memory sections . . . . . . . . . . . . . . . . . . .29

Table 16. Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .30

Table 17. ReadProtect command. . . . . . . . . . . . . . . . . . .36

Table 18. G2X reply to a successful ReadProtect

procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Table 19. ReadProtect command-response table . . . . . .37

Table 20. Reset ReadProtect command . . . . . . . . . . . . .39

Table 21. G2X reply to a successful Reset ReadProtect

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 22. Reset ReadProtect command-response

table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 23. ChangeEAS command . . . . . . . . . . . . . . . . . . 40

Table 24. G2X reply to a successful ChangeEAS

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Table 25. ChangeEAS command-response table . . . . . . 41

Table 26. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 42

Table 27. G2X reply to a successful EAS_Alarm

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 28. Eas_Alarm command-response table. . . . . . . 43

Table 29. Calibrate command . . . . . . . . . . . . . . . . . . . . . 44

Table 30. G2X reply to a successful Calibrate

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Table 31. Calibrate command-response table . . . . . . . . . 44

Table 32. Practical example of CRC calculation for a

'Req_RN' command by the reader . . . . . . . . . 45

Table 33. Practical example of CRC calculation for a

'Req_RN' command by the reader. . . . . . . . . . 46

Table 34. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 47

Table 35. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 50

23. Figures

Fig 1.

Block diagram of G2X IC . . . . . . . . . . . . . . . . . . . .4

Fig 2.

Wafer layout and pinning information . . . . . . . . . .5

Fig 3.

Pinning - SOT1040-1 . . . . . . . . . . . . . . . . . . . . . . .6

Fig 4.

Package TSSOP8, SOT505-1 . . . . . . . . . . . . . . . .7

Fig 5.

Package outline SOT1122 . . . . . . . . . . . . . . . . . . .9

Fig 6.

Package FCS2, SOT1040AA1, 12 mm Cu

metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Fig 7.

Package FCS2, SOT1040AB2, 20 mm Al

metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Fig 8.

Splicing drawing SOT1040-1 . . . . . . . . . . . . . . . .13

Fig 9.

G2X TID memory structure . . . . . . . . . . . . . . . . .29

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