2010-01-12

8

SFH 4240

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020C)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020C)

Wellenlöten (TTW)

(nach CECC 00802)

TTW Soldering

(acc. to CECC 00802)

OHLA0687

0

0

T

t

˚C

s

120 s max

50

100

150

200

250

300

Ramp Up

100 s max

50

100

150

200

250

300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

+5 ˚C

Minimum Solder Profile

10 s min

OHLY0598

0

0

50

100

150

200

250

50

100

150

200

250

300

T

t

C

s

235 C

10 s

C

... 260

1. Welle

1. wave

2. Welle

2. wave

5 K/s

2 K/s

ca 200 K/s

CC

... 130

100

2 K/s

Zwangskühlung

forced cooling

Normalkurve

standard curve

Grenzkurven

limit curves