Package outline

Page 2

Chip Silicon Rectifier

Formosa MS

Features

Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

Low profile surface mounted application in order to

optimize board space..

iny plastic SMD package.

High current capability.

High surge current capability.

Glass passivated chip junction.

Lead-free parts meet RoHS requirments.

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1.0A Surface Mount Super

Fast Rectifiers-50-600V

PARAMETER

CONDITIONS

Forward rectified current

Forward surge current

Reverse current

Diode junction capacitance

Storage temperature

See Fig.2

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

f=1MHz and applied 4V DC reverse voltage

Symbol

MIN.

TYP.

MAX.

UNIT

I

O

I

FSM

I

R

C

J

T

STG

A

A

uA

pF

1.0

25

5.0

+175

-65

O

V

= V

T = 25 C

R

RRM

J

O

V

= V

T = 125 C

R

RRM

J

10

100

SFM11-MS

SFM12-MS

SFM13-MS

50

100

150

35

70

105

SYMBOLS

V

RRM

(V)

V

RMS

V

R

(V)

(V)

*1

*2

*3

V

F

(V)

*4

SFM14-MS

SFM15-MS

200

300

140

210

1.70

-55 to +150

SFM16-MS

SFM17-MS

400

500

280

350

t

rr

(ns)

*5

35

50

100

150

200

300

400

500

0.95

1.25

SFM18-MS

600

600

420

O

( C)

Operating

temperature

T ,

J

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage@I =1.0A

F

*5 Reverse recovery time, note 1

A

SFM11-MS THRU SFM18-MS

0.154(3.9)

0.138(3.5)

0.018(0.45) Typ.

0.079(2.0)

0.063(1.6)

0.040(1.00)

0.036(0.90)

0.032 (0.8) Typ.

0.032(0.8) Typ.

0.029(0.75)

0.037(0.95)

Dimensions in inches and (millimeters)

SOD-123S

0.009(0.22)

0.007(0.18)

0.119(3.0)

0.103(2.6)

DS-121449

2012/03/30

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A

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Mechanical data

Epoxy : UL94-V0 rated flame retardant

Method 2026

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