CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16

http://onsemi.com

17

PACKAGE DIMENSIONS

WLCSP5, 0.84x0.86

CASE 567DD

ISSUE B

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE

SPHERICAL CROWNS OF THE CONTACT BALLS.

4. COPLANARITY APPLIES TO SPHERICAL CROWNS

OF THE CONTACT BALLS.

5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-

TACT BALL DIAMETER PARALLEL TO DATUM C.

2X

DIM

A

MIN

MAX

0.29

MILLIMETERS

A1

D

0.84 BSC

E

b

0.14

0.18

e

0.30 BSC

0.39

E

D

A B

PIN A1

REFERENCE

e

0.05 C

5X

b

13

C

A

0.10 C

A1

A2

C

0.10

0.14

0.86 BSC

0.10 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 4

e1

A2

0.23 REF

PITCH

0.16

5X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.52

0.30

RECOMMENDED

A1

PACKAGE

OUTLINE

PITCH

NOTE 3

A

NOTE 5

A

M

0.10

B

C

e1

0.52 BSC

PIN A1

REFERENCE

B

2