4

Solderability tests

Test

Standard

Test conditions /

Sn-Pb soldering

Test conditions /

Pb-free soldering

Criteria / test results

Wettability

IEC

60068-2-58

Immersion in

60/40 SnPb solder

using non-activated

flux at 215

±3 °C for

3

±0.3 s

Immersion in

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

at 245

±5 °C

for 3

±0.3 s

Covering of 95%

of end termination,

checked by visual

inspection

Leaching

resistance

IEC

60068-2-58

Immersion in

60/40 SnPb

solder using

mildly activated flux

without preheating

at 255

±5 °C

for 10

±1 s

Immersion in

Sn96.5Ag3.0Cu0.5

solder using non- or

low activated flux

without preheating

at 255

±5 °C

for 10

±1 s

No leaching of

contacts

Tests of

resistance to

soldering heat

for SMDs

IEC

60068-2-58

Immersion in

60/40 SnPb for 10 s

at 260

°C

Immersion in

Sn96.5Ag3.0Cu0.5

for 10 s at 260

°C

Capacitance change:

15%

≤∆C ≤15%

Note:

Leaching of the termination

Effective area at the termination might be lost if the soldering temperature and/or immersion time

are not kept within the recommended conditions. Leaching of the outer electrode should not ex-

ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,

shown below as mounted on the substrate.

As single chip

As mounted on substrate

CeraDiodes

High-speed series

Page 15 of 22

Please read Cautions and warnings and

Important notes at the end of this document.