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3003 데이터시트(PDF) 70 Page - NXP Semiconductors

부품명 3003
상세설명  RF Manual 16th edition
PDF  130 Pages
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제조업체  NXP [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo NXP - NXP Semiconductors

3003 데이터시트(HTML) 70 Page - NXP Semiconductors

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NXP Semiconductors RF Manual 16th edition
2.6.2
CompletingNXP'sRFpowertransistoroffering:productsinplasticpackages(OMP)
NXP is currently developing a complete line of overmolded plastic (OMP) RF power
transistors and MMICs with peak powers ranging from 3 to 500 W. The main benefit of
plastic packages is cost effectiveness with little or no impact on performance. The range
of plastic devices will complement the extensive range of RF power products that NXP
offers in ceramic packages for all frequency ranges and applications up to 2.45 GHz.
Products in development
` Single-stage broadband drivers in HSOP-outlines, from
3 to 10 W
` Single-stage OMP drivers from 25 to 45 W, replacing
their ceramic equivalents for cost-sensitive applications
` Dual-stage MMICs from 30 to 60 W that can be used as
high-gain drivers or combined as low-power dual-stage
Doherty amplifiers
` Fully integrated plug-and-play Doherty PAs in a single
package (50 to 100 W)
` Final transistors in OMP package (SOT502-sized) ranging
from 140 to 200 W in frequency bands from 730 MHz
to 2.2 GHz
` Final transistors in OMP package (SOT502-sized) ranging
from 3 to 500 W in ISM frequency bands from a few MHz
up to 2.45 GHz
Some of these products are available for sampling now, while
the rest of the portfolio will be rolled out throughout 2012.
Type
f
min
(MHz)
f
max
(MHz)
P1dB
(W)
Matching Package
Description
BLP7G22-10
700
2200
10
-
SOT1179
Gen7 OMP LDMOS transistor for WCDMA & GSM applications
BLM7G22S-60PB(G)
2000
2200
60
I/O
SOT1212
Gen7 LDMOS MMIC for WCDMA applications (gull-wing)
BLP7G07S-140P(G)
700
900
140
O
SOT1224
Gen7 OMP push-pull LDMOS transistor for GSM, WCDMA & LTE applications (gull-wing)
BLP7G09S-140P(G)
900
1000
140
O
SOT1224
Gen7 OMP push-pull LDMOS transistor for GSM, WCDMA & LTE applications (gull-wing)
RF power products in plastic packages (OMP)



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