LT3013

19

3013fe

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

DE Package

12-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1695)

4.00 ±0.10

(2 SIDES)

3.00 ±0.10

(2 SIDES)

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

NOTE:

1. DRAWING PROPOSED TO BE A VARIATION OF VERSION

(WGED) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

0.38 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

R = 0.20

TYP

0.25 ± 0.05

3.30 ±0.10

(2 SIDES)

1

6

12

7

0.50

BSC

PIN 1

NOTCH

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(UE12/DE12) DFN 0603

0.25 ± 0.05

3.30 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.70 ±0.05

(2 SIDES)

2.20 ±0.05

0.50

BSC

0.65 ±0.05

3.50 ±0.05

PACKAGE OUTLINE

FE16 (BB) TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

13

4

5 6 7 8

10

9

4.90 – 5.10*

(.193 – .201)

16 1514 13 12 11

1.10

(.0433)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

2.94

(.116)

0.195 – 0.30

(.0077 – .0118)

TYP

2

RECOMMENDED SOLDER PAD LAYOUT

0.45 ±0.05

0.65 BSC

4.50 ±0.10

6.60 ±0.10

1.05 ±0.10

2.94

(.116)

3.58

(.141)

3.58

(.141)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC

FE Package

16-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation BB