Hardware design

SPBT2632C2A

16/27

Doc ID 022833 Rev 4

7

Hardware design

and GPIO hardware interfaces. Note that the usage of these interfaces is dependent upon

the firmware that is loaded into the module, and is beyond the scope of this document. The

AT2 command interface uses the main UART by default.

Note:

1

All unused pins should be left floating; do not ground.

2

All GND pins must be well grounded.

3

The area around the module should be free of any ground planes, power planes, trace

routings, or metal for 6 mm from the antenna in all directions.

4

Traces should not be routed underneath the module.

7.1

Module reflow installation

The SPB2632C2A is a surface mount Bluetooth module supplied on a 16-pin, 6-layer PCB.

The final assembly recommended reflow profiles are indicated here below.

The soldering phase must be executed with care: In order to avoid undesired melting

phenomenon, particular attention must be paid to the setup of the peak temperature.

The following are some suggestions for the temperature profile based on IPC/JEDEC J-

STD-020C, July 2004 recommendations.

Table 8.

Soldering

Profile feature

PB-free assembly

3 °C/sec max

Preheat:

150 °C

200 °C

60-100 sec

Time maintained above:

217 °C

60-70 sec

240 + 0 °C

10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.