STPS30M100DJF datasheet(4/8 Pages) STMICROELECTRONICS

4 / 8 page

Characteristics

STPS30M100DJF

4/8

Doc ID 16751 Rev 4

Figure 12.

Reverse safe operating area (tp < 1 µs and Tj < 150 °C)

Figure 8.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 9.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 10.

Forward voltage drop versus

forward current

Figure 11.

Thermal resistance junction to

ambient versus copper surface

under tab

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1020

304050

60708090

100

T = 25 °C

T = 50 °C

T = 75 °C

T = 125 °C

T = 150 °C

T = 100 °C

I (mA)

V (V)

100

1000

10000

100

F = 1 MHz

= 30 mV

T = 25 °C

osc

RMS

C(pF)

V (V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

T = 125 °C

(Maximum values)

T = 125 °C

(Typical values)

T = 25 °C

(Maximum values)

(A)

(V)

100

150

200

250

678

(°C/W)

th(j-a)

S (cm²)

Epoxy printed circuit board FR4,

copper thickness = 35 µm

100

150

140

130

120

110

(A)

arm

(V)

arm

Forbidden area

Operating area

) 150 °C, 1µs

arm

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