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NE556 데이터시트(PDF) 3 Page - STMicroelectronics |
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NE556 데이터시트(HTML) 3 Page - STMicroelectronics |
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3 / 16 page ![]() NE556 - SA556 - SE556 Absolute maximum ratings and operating conditions 3/16 2 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings Symbol Parameter Value Unit VCC Supply voltage 18 V IOUT Output current (sink and source) ±225 mA Rthja Thermal resistance junction to ambient(1) DIP14 SO-14 1. Short-circuits can cause excessive heating. These values are typical and valid only for a single layer PCB. 80 105 °C/W Rthjc Thermal resistance junction to case (1) DIP14 SO-14 33 31 °C/W ESD Human body model (HBM)(2) 2. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5k Ω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 1000 V Machine model (MM)(3) 3. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected pin combinations while the other pins are floating. 150 Charged device model (CDM)(4) 4. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. 1500 Latch-up immunity 200 mA TLEAD Lead temperature (soldering 10 seconds) 260 °C Tj Junction temperature 150 °C Tstg Storage temperature range -65 to 150 °C Table 2. Operating conditions Symbol Parameter Value Unit VCC Supply voltage NE556 SA556 SE556 4.5 to 16 4.5 to 16 4.5 to 18 V Vth, Vtrig, Vcl, Vreset Maximum input voltage VCC V IOUT Output current (sink and source) ±200 mA Toper Operating free air temperature range NE556 SA556 SE556 0 to 70 -40 to 105 -55 to 125 °C |
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