DIP2450-01D3

Package information

Doc ID 023193 Rev 1

7/10

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 19.

Package dimensions

Figure 20.

Footprint

Figure 21.

Marking

2G

5G

ANT

GND

725 µm

1.1 mm ±50 µm

630 µm ±60 µm

200 µm

Ø255 µm ±40 µm

Copper pad diameter:

220 µm recommended

Solder stencil opening:

220 µm recommended

Solder mask opening:

300 µm minimum

260 µm maximum

x

y

x

w

z

w

Dot, ST logo

ECOPACK status

xx = marking

z = manufacturing

location

yww = datecode

(y = year

ww = week)