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ECMF06-6AM16 데이터시트(PDF) 14 Page - STMicroelectronics |
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ECMF06-6AM16 데이터시트(HTML) 14 Page - STMicroelectronics |
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14 / 16 page ![]() Recommendation on PCB assembly ECMF06-6AM16 14/16 Doc ID 022284 Rev 2 5.5 Reflow profile Figure 21. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -6°C/s 240-245 °C 2 - 3 °C/s Temperature (°C) -2 °C/s -3 °C/s Time (s) 0.9 °C/s 60 sec (90 max) |
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