EMIF03-SIM04F3

Package information

Doc ID 17053 Rev 2

5/7

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 10.

Package dimensions

Figure 13.

Flip-Chip tape and reel specification

Figure 11.

Footprint

Figure 12.

Marking

1.54 mm ± 30 µm

255 µm ± 40

400 µm ± 30

605 µm ± 55

170 µm

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK® Grade

User direction of unreeling

All dimensions in mm

4.0 ± 0.1

2.0 ± 0.05

Ø 1.5 ± 0.1

0.69 ± 0.05

1.31

4.0 ± 0.1

Dot identifying pin A1 location