Package information

ST1284

8/10

Doc ID 6976 Rev 4

4

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 10.

Footprint (dimensions in mm)

Table 3.

QSOP28 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

1.55

1.75

0.061

0.069

a1

0.10

0.25

0.004

0.010

b

0.20

0.30

0.008

0.012

b1

0.18

0.25

0.007

0.010

D

9.80

9.98

0.386

0.393

E

3.80

3.98

0.15

0.157

e

0.64 typ.

0.025 typ.

F

5.79

6.20

0.228

0.244

L

0.40

0.90

0.016

0.035

S

8° max

8° max

Table 4.

Mechanical specifications

Lead plating

Tin-lead

Lead plating thickness

7 µm min.

25 µm max.

Lead material

Copper Alloy

Lead coplanarity

0.102 mm (0.004”)

Body material

Molded epoxy

Resin

Meets UL94V-0 standard

28

15

14

1

b

a1

e

S

L

E

F

D

b1

A

0.64

0.40

6.70

3.70

1.50