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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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WM8945ECS/R 데이터시트(PDF) 167 Page - Wolfson Microelectronics plc |
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WM8945ECS/R 데이터시트(HTML) 167 Page - Wolfson Microelectronics plc |
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167 / 169 page  Production Data WM8945 w PD, May 2011, Rev 4.1 167 PACKAGE DIMENSIONS B: 36 BALL W-CSP PACKAGE 2.960 X 3.060 X 0.7mm BODY, 0.50 mm BALL PITCH A1 CORNER TOP VIEW E Z 0.10 2 X D 5 4 DETAIL 2 DETAIL 2 A A2 2 Z 0.10 2 X A1 Z bbb Z 1 E1 A D1 DETAIL 1 D C B F E e e BOTTOM VIEW 1 65 4 32 6 G NOTES: 1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING. 3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE. 4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY. 5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH. 6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. 7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C. A1 0.219 D D1 E E1 e 2.500 BSC 3.060 BSC 0.220 2.500 BSC 0.500 BSC 2.960 BSC Dimensions (mm) Symbols MIN NOM MAX NOTE A 0.7 A2 0.361 0.386 0.411 5 f1 0.785 0.615 0.244 0.269 g 0.070 0.035 0.105 h 0.314 BSC f2 0.270 f1 f2 h DM063.A |
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