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IRF7821 데이터시트(PDF) 3 Page - Richtek Technology Corporation

부품명 IRF7821
상세설명  6A, 24V, 600kHz Step-Down Converter with Synchronous Gate Driver
PDF  18 Pages
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제조업체  RICHTEK [Richtek Technology Corporation]
홈페이지  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

IRF7821 데이터시트(HTML) 3 Page - Richtek Technology Corporation

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DS8298-01
November 2011
www.richtek.com
RT8298
Copyright
2011 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
©
Functional Pin Description
Pin No.
WDFN-14L 4x3
SOP-8
(Exposed Pad)
Pin Name
Pin Function
1
6
FB
Feedback Input. This pin is connected to the converter output. It
is used to set the output of the converter to regulate to the
desired value via an external resistive divider. The feedback
reference voltage is 0.808V typically.
2
--
PGOOD
Power Good Indicator with Open Drain. (for RT8298ZQW only)
A 100k
Ω pull-high resistor is needed. The output of this pin is
pulled to low when the FB is lower than 0.75V; otherwise it is
high impedance.
3
7
EN/SYNC
Enable
or External Frequency
Synchronization
Input. A
logic-high (2V < EN < 5.5V) enables the converter; a logic-low
forces the IC into shutdown mode reducing the supply current to
less than 3
μA. For external frequency synchronization operation,
the available frequency range is from 300kHz to 1.5MHz.
4, 5, 6
8
VIN
Power Input. The available input voltage range is from 4.5V to
24V. A 22
μF or larger input capacitor is needed to reduce
voltage spikes at the input.
7
--
NC
No Internal Connection.
8, 9, 10
1
SW
Switching Node. Output of the internal high side MOSFET.
Connect this pin to external low-side N-MOSFET, inductor and
bootstrap capacitor.
11
2
BOOT
Bootstrap for High side Gate Driver. Connect a 1
μF ceramic
capacitor between the BOOT pin and SW pin.
12
3
VCC
BG Driver Bias Supply. Decouple with a 1
μF X5R/X7R ceramic
capacitor between the VCC pin and GND.
13
4
BG
Gate Driver Output. Connect this pin to the gate of the external
low-side N-MOSFET.
14,
15 (Exposed Pad)
5,
9 (Exposed Pad)
GND
Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum thermal dissipation.



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