ADG5412/ADG5413

Rev. A | Page 9 of 20

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

IN2

16

D2

15

S2

14

13

NC

12

S3

11

D3

10

IN3

9

NC = NO CONNECT

ADG5412/

ADG5413

TOP VIEW

(Not to Scale)

Figure 2. TSSOP Pin Configuration

NOTES

2. NC = NO CONNECT.

PIN 1

INDICATOR

1

S1

2

3

GND

4

S4

12 S2

10 NC

9S3

ADG5412/

ADG5413

TOP VIEW

(Not to Scale)

Figure 3. LFCSP Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

TSSOP

LFCSP

Mnemonic

Description

1

15

IN1

Logic Control Input 1.

2

16

D1

Drain Terminal 1. This pin can be an input or output.

3

1

S1

Source Terminal 1. This pin can be an input or output.

4

2

Most Negative Power Supply Potential.

5

3

GND

Ground (0 V) Reference.

6

4

S4

Source Terminal 4. This pin can be an input or output.

7

5

D4

Drain Terminal 4. This pin can be an input or output.

8

6

IN4

Logic Control Input 4.

9

7

IN3

Logic Control Input 3.

10

8

D3

Drain Terminal 3. This pin can be an input or output.

11

9

S3

Source Terminal 3. This pin can be an input or output.

12

10

NC

No Connection.

13

11

Most Positive Power Supply Potential.

14

12

S2

Source Terminal 2. This pin can be an input or output.

15

13

D2

Drain Terminal 2. This pin can be an input or output.

16

14

IN2

Logic Control Input 2.

EP

Exposed Pad

The exposed pad is connected internally. For increased reliability of the solder joints

and maximum thermal capability, it is recommended that the pad be soldered to the

Table 8. ADG5412 Truth Table

INx

Switch Condition

1

On

0

Off

Table 9. ADG5413 Truth Table

INx

S1, S4

S2, S3

0

Off

On

1

On

Off