ADP2441ACPZ-R2 datasheet(5/32 Pages) AD

5 / 32 page

Data Sheet

ADP2441

Rev. A | Page 5 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN to PGND

−0.3 V to +40 V

EN to AGND

−0.3 V to +40 V

SW to PGND

−0.3 V to +40 V

BST to PGND

−0.3 V to +45 V

VCC to AGND

−0.3 V to +6 V

BST to SW

−0.3 V to +6 V

FREQ, PGOOD, SS/TRK, COMP, FB to AGND

−0.3 V to +6 V

PGND to AGND

±0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages, and is

based on a 4-layer standard JEDEC board.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

12-Lead LFCSP

2.4

°C/W

ESD CAUTION

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