AD5313 datasheet(5/18 Pages) AD

5 / 18 page

REV. 0

AD5303/AD5313/AD5323

–5–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD5303/AD5313/AD5323 features proprietary ESD protection circuitry, perma-

nent damage may occur on devices subjected to high energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1, 2

(TA = +25

°C unless otherwise noted)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V

VOUTA, VOUTB to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . –40

°C to +105°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . +150

°C

16-Lead TSSOP Package

Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/

θJA

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Transient currents of up to 100 mA will not cause SCR latch-up.

PIN CONFIGURATION

TOP VIEW

(Not to Scale)

CLR

LDAC

VDD

VREFB

VREFA

VOUTA

BUF A

BUF B

SDO

GND

DIN

SCLK

SYNC

VOUTB

DCEN

AD5303/

AD5313/

AD5323

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD5303BRU

–40

°C to +105°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

AD5313BRU

–40

°C to +105°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

AD5323BRU

–40

°C to +105°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

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